? 2005 california micro devices corp. all rights reserved. 11/08/05 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 1 cm1440 6 channel emi filter a rray with esd protection features ? six channels of emi filtering for data ports ? pi-style emi filters in a capacitor-resistor-capacitor (c-r-c) network ? 30kv esd protection on each channel (iec 61000-4-2 level 4, contact discharge) ? 30kv esd protection on each channel (hbm) ? greater than 35db attenuation (typical) at 1 ghz ? 15-bump, 0.4mm pitch, 2.360mm x 1.053mm foot- print chip scale package (csp) ? chip scale package features extremely low lead inductance for optimum filter and esd performance ? optiguard ? coated for improved reliability at assembly ? lead-free version available applications ? lcd and camera data lines in mobile handsets ? i/o port protection for mobile handsets, notebook computers, pdas etc. ? emi filtering for data port s in cell phones, pdas or notebook computers. ? wireless handsets ? handheld pcs/pdas ? lcd and camera modules product description the cm1440 is a six channel low-pass emi filter array with esd protection that reduces emi/rfi emissions while providing robust protection from esd strikes. each emi filter channel in tegrates a high quality pi- style filter (30pf-100 -30pf) which provides greater than 30db of attenuation in the 800mhz to 2.7ghz fre- quency range. the parts include avalanche-type esd diodes on every pin, which provide a very high level of protection for sensitive elec tronic components that may be subjected to electrostatic discharge (esd). the esd protection diodes connected to the filter ports safely dissipate esd strikes of 30kv, beyond the maximum requirement of the iec61000-4-2 interna- tional standard. using th e mil-std-883 (method 3015) specification for human body model (hbm) esd, the pins are protected for cont act discharges at greater than 30kv. this device is particularly we ll-suited for portable elec- tronics (e.g. wireless handsets, pdas, notebook com- puters) because of its small package and easy-to-use pin assignments. in particular, the cm1440 is ideal for emi filtering and protecting data and control lines for the i/o data ports, lcd display and camera interface in mobile handsets. the cm1440 incorporates optiguard ? which results in improved reliability at assembly. the cm1440 is available in a space saving, low profile chip scale package with optional lead-free finishing. it is manu- factured with a 0.40mm pitch and 0.25mm csp solder ball to provide up to 28% board space savings versus competing csp devices with 0.50mm pitch and 0.30mm csp solder ball. electrical schematic 100 30pf 30pf filtern* gnd filtern* (pins b1-b3) 1 of 6 emi/rfi + esd channels * see package/pinout diagram for expanded pin information. (pins a1-a6) (pins c1-c6)
? 2005 california micro devices corp. all rights reserved. 2 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 11/08/05 cm1440 ordering information note 1: parts are shipped in tape & reel form unless otherwise specified. note 2: lead-free devices ar e specified by using a " + " character for the top side orientation mark. pin descriptions pin(s) name description a1 filter1 filter channel 1 a2 filter2 filter channel 2 a3 filter3 filter channel 3 a4 filter4 filter channel 4 a5 filter5 filter channel 5 a6 filter6 filter channel 6 b1-b3 gnd device ground c1 filter1 filter channel 1 c2 filter2 filter channel 2 c3 filter3 filter channel 3 c4 filter4 filter channel 4 c5 filter5 filter channel 5 c6 filter6 filter channel 6 filter5 filter6 gnd filter5 filter6 a6 a5 orientation marking b3 c6 c5 filter3 filter4 gnd filter3 filter4 a4 a3 b2 c4 c3 filter1 filter2 gnd filter1 filter2 a2 a1 b1 c2 c1 a1 n406 4 3 26 5 1 c b a orientation marking (see note 2) package / pinout diagrams notes: bottom view cm1440-06cs/cp 15 bump csp package (bumps up view) top view (bumps down view) 1) these drawings are not to scale. 2) lead-free devices are specified by using a " + " character for the top side orientation mark. part numbering information pins package standard finish lead-free finish 2 ordering part number 1 part marking ordering part number 1 part marking 15 csp cm1440-06cs n406 CM1440-06CP n406
? 2005 california micro devices corp. all rights reserved. 11/08/05 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 3 cm1440 specifications note 1: t a =25 c unless otherwise specified. note 2: esd applied to input and output pins with respect to gnd, one at a time. note 3: these parameters are guarant eed by design and characterization. absolute maximum ratings parameter rating units storage temperature range -65 to +150 c dc power per resistor 100 mw dc package power rating 500 mw standard operat ing conditions parameter rating units operating temperature range -40 to +85 c electrical operat ing characteristics (see note1) symbol parameter conditions min typ max units r resistance 80 100 120 c total total channel capacitance at 2.5vdc reverse bias, 1mhz, 30mvac 48 60 72 pf c capacitance c1 at 2.5vdc reverse bias, 1mhz, 30mvac 24 30 36 pf v diode standoff voltage i diode =10 a6.0v i leak diode leakage current (reverse bias) v diode = + 3.3v 0.1 1 a v sig signal clamp voltage positive clamp negative clamp i load = 10ma 5.6 -1.5 6.8 -0.8 9.0 -0.4 v v v esd in-system esd withstand voltage a) human body model, mil-std-883, method 3015 b) contact discharge per iec 61000-4-2 level 4 notes 2 and 3 30 30 kv kv r dyn dynamic resistance positive negative 2.3 0.9 f c cut-off frequency z source =50 , z load =50 r=100 , c=30pf 60 mhz
? 2005 california micro devices corp. all rights reserved. 4 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 11/08/05 cm1440 performance information typical filter performance (t a =25c, dc bias=0v, 50 ohm environment) figure 1. insertion loss vs. frequency (a1-c1 to gnd b1) figure 2. insertion loss vs. frequency (a2-c2 to gnd b1)
? 2005 california micro devices corp. all rights reserved. 11/08/05 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 5 cm1440 performance information (cont?d) typical filter performance (t a =25c, dc bias=0v, 50 ohm environment) figure 3. insertion loss vs. frequency (a3-c3 to gnd b2) figure 4. insertion loss vs. frequency (a4-c4 to gnd b2)
? 2005 california micro devices corp. all rights reserved. 6 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 11/08/05 cm1440 performance information (cont?d) typical filter performance (t a =25c, dc bias=0v, 50 ohm environment) figure 5. insertion loss vs. frequency (a5-c5 to gnd b3) figure 6. insertion loss vs. frequency (a6-c6 to gnd b3)
? 2005 california micro devices corp. all rights reserved. 11/08/05 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 7 cm1440 performance information (cont?d) typical diode capacitance vs. input voltage figure 7. filter capacitance vs. input voltage (normalized to capacitance at 2.5vdc and 25c) capacitance (normalized) dc voltage
? 2005 california micro devices corp. all rights reserved. 8 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 11/08/05 cm1440 application information refer to application no te ap-217, "the chip scale package", for a detailed description of chip scale packages offered by california micro devices. figure 8. recommended non-solder mask defined pad illustration figure 9. eutectic (snpb) solder ball reflow profile figure 10. lead-free (snagcu) solder ball reflow profile printed circuit boar d recommendations parameter value pad size on pcb 0.240mm pad shape round pad definition non-solder mask defined pads solder mask opening 0.290mm round solder stencil thickness 0.125mm - 0.150mm solder stencil aperture opening (laser cut, 5% tapered walls) 0.300mm round solder flux ratio 50/50 by volume solder paste type no clean pad protective finish osp (entek cu plus 106a) tolerance ? edge to corner ball + 50 m solder ball side coplanarity + 20 m maximum dwell time above liquidous (183c) 60 seconds maximum soldering temperature for a eutectic device using eutectic solder paste 240c maximum soldering temperature for a lead-fr ee device using lead-free solder paste 260c solder mask opening 0.290mm dia. non-solder mask defined pad 0.240mm dia. solder stencil opening 0.300mm dia. 200 250 150 100 50 0 1:00.0 2:00.0 3:00.0 4:00.0 time (minutes) temperature (c)
? 2005 california micro devices corp. all rights reserved. 11/08/05 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 9 cm1440 mechanical details csp mechanical specifications cm1440 devices are supplied in a custom chip scale package (csp). dimensions are presented below. for complete information on csp packaging, see the cali- fornia micro devices csp package information docu- ment. package dimensions for cm1440 chip scale package csp tape and reel specifications figure 11. tape and reel mechanical data package dimensions package custom csp bumps 15 dim millimeters inches min nom max min nom max a1 2.3150 2.3600 2.4050 0.911 0.0929 0.0947 a2 1.008 1.053 1.098 0 .0397 0.0415 0.0432 b1 0.395 0.4000 0.405 0.0156 0.0157 0.0159 b2 0.195 0.2000 0.205 0.0076 0.0078 0.0080 b3 0.3415 0.3465 0.3515 0.0134 0.0136 0.0138 b4 0.3415 0.3465 0.3515 0.0134 0.0136 0.0138 c1 0.130 0.1800 0.230 0.0051 0.0071 0.0091 c2 0.130 0.1800 0.230 0.0051 0.0071 0.0091 d1 0.575 0.644 0.714 0 .0226 0.0254 0.0281 d2 0.368 0.419 0.470 0 .0145 0.0165 0.0185 # per tape and reel 3500 pieces controlling dimension: millimeters mechanical package diagrams a b c 3456 c1 b1 a1 b3 c2 dimensions in millimeters d1 d2 a2 bottom view side view 12 b2 b4 0.25 dia. 63/37 sn/pb (eutectic) or solder bumps 96.8/2.6/0.6 sn/ag/cu (lead-free) optiguard tm coating part number chip size (mm) pocket size (mm) b 0 x a 0 x k 0 tape width w reel diameter qty per reel p 0 p 1 cm1440 2.36 x 1.053x 0.644 2.62 x 1.12x 0.76 8mm 178mm (7") 3500 4mm 4mm to p for tape feeder reference cover tape p 1 only including draft. concentric around b. k o embossment user direction of feed 0.2 mm p o center lines of cavity w 10 pitches cumulative tolerance on tape a o b o
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